schottky barrier rectifiers APD140 data sheet 1 mar. 2010 rev. 1. 4 bcd semiconductor manufacturing limited features low forward vo ltage drop very small conduction losses high surge capability surge overload rating up to 35a peak value applications low voltage high frequency inverters dc-dc converters free wheeling polarity protection figure 1. package type of APD140 do-41 figure 2. pin configuration of APD140 pin configuration vd package (do-41) cathod anode vr package (do-214ac) anode cathod do-214ac
schottky barrier rectifiers APD140 data sheet 2 mar. 2010 rev. 1. 4 bcd semiconductor manufacturing limited parameter symbol value unit maximum repetitive reverse voltage v rrm 40 v maximum dc blocking voltage v dc maximum rms voltage v rms 28 v average rectified forward current 0.375 " (9.5mm) lead length, (see figure 1) i f(av) 1.0 a non-repetitive peak forward surge current 8.3 ms single half sine-wave on rated load i fsm 35 a voltage rate of change (rated v r ) dv/dt 10000 v/ s operating junction temperature range t j -65 to 125 o c storage temperature range t st -65 to 150 o c absolute maximum ratings (t a =25 o c, unless otherwise noted) (note 1) package temperature range part number marking id packing type lead free green lead free green do-41 -65 to 125 o c APD140vd-e1 APD140vd-g1 d140vd 140vdg bulk APD140vdtr-e1 APD140vdt r-g1 d140vd 140vdg ammo do-214ac -65 to 125 o c APD140vrtr-g1 140vrg tape & reel circuit type package vd: do-41 e1: lead free APD140 - tr: blank: bulk ordering information tape & reel or ammo note 1: stresses greater than those li sted under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only, and functiona l operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. ex posure to "absolute maximum ratings" for extended periods may affect device reliability. g1: green bcd semiconductor's pb-free products, as designated with "e1" suffix in the part number, are rohs compliant. products with "g1" suffix are available in green packages. vr: do-214ac
schottky barrier rectifiers APD140 data sheet 3 mar. 2010 rev. 1. 4 bcd semiconductor manufacturing limited parameter symbol values unit typical thermal resistance (note 2) ja do-41 65 o c/w do-214ac 100 parameter symbol values unit forward voltage @ i f =1.0a v f 0.5 v reverse current @ rated v r (note 3) t a =25 o c i r 0.5 ma t a =100 o c 10 electrical characteristics (t a =25 o c, unless otherwise noted) note 3: pulse test: 300 s pulse width, 1.0% duty cycle. note 2: thermal resistance from junction to lead, pcb mounted, 0.375" (9.5mm) lead length. figure 3. forward current derating curve figure 4. typical instantaneous forward characteristics typical performance characteristics (t a =25 o c, unless otherwise noted) 0 25 50 75 100 125 150 0.00 0.25 0.50 0.75 1.00 1.25 average forward current (a) lead temperature ( o c) resistive or inductive load 0.375" (9.5mm) lead length 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.01 0.1 1 10 50 instantaneous forward current (a) instantaneous forward voltage (v) t j =25 o c t j =125 o c thermal characteristics (t a =25 o c, unless otherwise noted)
schottky barrier rectifiers APD140 data sheet 4 mar. 2010 rev. 1. 4 bcd semiconductor manufacturing limited figure 5. maximum non-repetitive figure 6. typical reverse characteristics figure 7. typical junction capacitance typical performance ch aracteristics (continued) peak forward surge current 0 20406080100 1e-3 0.01 0.1 1 10 100 instantanous reverse current (ma) percent of rated peak reverse voltage (%) t j =25 o c t j =125 o c 110100 10 15 20 25 30 35 40 peak forward surge current (a) number of cycles at 60hz t j =t j max 8.3ms single half sine-wave 0.1 1 10 100 10 100 400 junction capacitance (pf) reverse voltage (v) t j =25 o c f=1.0mhz v sig =50mvp-p
schottky barrier rectifiers APD140 data sheet 5 mar. 2010 rev. 1. 4 bcd semiconductor manufacturing limited mechanical dimensions unit: mm(inch) do-41 0.700(0.028) 0.900(0.035) 25.400(1.000) min 4.200(0.165) 5.200(0.205) 2.000(0.080) 2.700(0.107) dia. dia. 25.400(1.000) min
schottky barrier rectifiers APD140 data sheet 6 mar. 2010 rev. 1. 4 bcd semiconductor manufacturing limited mechanical dimensions unit: mm(inch) do-214ac 3.990(0.157) 4.500(0.177) 2.540(0.100) 2.790(0.110) 1.250(0.049) 1.650(0.065) 4.910(0.194) 5.280(0.208) 0.760(0.030) 1.520(0.060) 1.980(0.078) 2.290(0.090) 0.100(0.004) 0.200(0.008) 0.152(0.006) 0.305(0.012)
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited
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